Book
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Title
The Asian engineering brain drain : a study of international relocation into the United States from India, China, Korea, Thailand and Japan
Call No
TA157
Authors
Subjects
Language
English
Published
Lexington, Mass. : Heath Lexington Books, 1970.
Publication Desc
xiv, 181 p. : illus., forms. ;
LCCN
75115484 //r71
Dimensions
24 cm.